High-temperature-endurance Epoxy Resin
Introduction of product:
Due to the multi-function groups existing in the molecules of Novalac eoxy resin, a large amount of tight cross-bonds are formed after being cured, resulting in excellent thermal stability, mechanical intension, electricity insulation and chemcials resistance. It is mained used in microelectronic industry. Widely used for pouring and sealing of parts of semiconductors and integrated circuit.
Phenolic epoxy resin has more than two epoxy groups in a linear molecule, leading to a high crossing density after being cured with good thermal and chemical resistance. It is mainly used for chemical antiseptic, adhesive, laminated plates and sealing.
Executive standards:
Specifications：
No |
Brand |
Epoxy equivalent(g/eq) |
Hydrolysable chlorine, wt% ≤
|
Inorgano-chlorine, wt% ≤ |
Softening
point (℃)
|
Melting viscosity
(mPa•s25℃)
|
Volatile wt%≤ |
Color (Gardner) ≤
|
1 |
CYDCN-100 |
195~210 |
0.015 |
0.0005 |
60~70 |
180~270 |
0.1 |
2 |
2 |
CYDCN-200 |
195~210 |
0.015 |
0.0005 |
60~75 |
340~550 |
0.15 |
2 |
3 |
CYDCN-200H |
195~210 |
0.015 |
0.0005 |
65~75 |
480~600 |
0.15 |
2 |
4 |
CYDPN-048 |
190~210 |
0.05 |
0.001 |
40~50 |
- |
0.5 |
2 |
5 |
CYDPN-051 |
190~210 |
0.05 |
0.001 |
25~40 |
- |
0.5 |
2 |
Applied standards in analysis:
- Q/SH 1085 134-2006measurement methods of epoxy equivalent of epoxy resin
- Q/SH 1085 135-2006measurement methods of hydrolysable chlorine of epoxy resin
- Q/SH 1085 136-2006measurement methods of inorganochlorine of epoxy resin
- Q/SH 1085 137-2006measurement methods of softening point of epoxy resin
- Q/SH 1085 140-2006measurement methods of melting viscosity of epoxy resin
- Q/SH 1085 141-2006measurement methods of volatile of epoxy resin
- Q/SH 1085 142-2006measurement methods of color of epoxy resin
|
